Thermal sensor with thermal barrier
US7692148B2 · kind B2 · utility
7Cited by
16References
58Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2006 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Oct 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides a sensor element formed in a first substrate and having a thermal barrier disposed between the sensor element and a heat source provided elsewhere on the first substrate. The thermal barrier includes at least one pair of trenches formed within the first substrate, individual trenches of the pair being separated by a cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.