Thermally enhanced ball grid array package formed in strip with one-piece die-attached exposed heat spreader
US7692276B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 9, 2007 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Jun 6, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and apparatuses for integrated circuit packages, such as ball grid array packages, and processes for assembling the same, are provided. A first strip includes an array of package substrate sections. An IC die is mounted to each package substrate section of the first strip. A second strip includes an array of leadframe sections. The second strip is positioned adjacent to the first strip to couple a planar protruding area of each leadframe section to a corresponding IC die mounted to the first strip. An encapsulating material is applied to the adjacently positioned first and second strips to fill a space between the first and second strips and to fill a cavity in a top surface of each leadframe section. A planar region of the first strip surrounding each centrally located cavity is not covered by the encapsulating material. The adjacently positioned first and second strips are singulated into a plurality of IC packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.