Patent · US Expired

Semiconductor switching module

US7692293B2 · kind B2 · utility

3Cited by

16References

19Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Walter Apfelbacher · Freihung, DE
Norbert Reichenbach · Amberg, DE
Johann Seitz · Amberg, DE

Key dates

Filing date	Dec 17, 2004
Grant date	Apr 6, 2010
Priority date	—
Expiry date	Dec 17, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor switching module includes a power semiconductor element that is embodied in planar technology. In at least one embodiment, the power semiconductor element is provided with a base layer, a copper layer, and at least one power semiconductor chip that is mounted on the copper layer, and another electrically conducting layer which covers at least one load terminal of the power semiconductor chip. According to at least one embodiment of the invention, devices are provided for safely connecting the load terminal to a load circuit. The devices are configured such that a contact area thereof presses in a planar manner onto the electrically conducting layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.