Hermetically sealed head disk assembly and method of sealing with soldering material
US7692891B2 · kind B2 · utility
18Cited by
15References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2006 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Nov 2, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B33/1466
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A sealed head disk assembly has a cover for enclosing major components of the head disk assembly. The cover has a hermetic seal encompassing an outer perimeter of the cover and a semi-hermetic seal inside a perimeter of the hermetic seal. The hermetic seal and semi-hermetic seal are juxtaposed to at least one complementary surface on the base casting. The base casting, which provides attachment points for the major components of the head disk assembly has at least one complementary surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.