Apparatus and methods for interconnecting electrical circuit substrates and components
US7692933B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2008 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Jul 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10598
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A stand-off having a flange and a projecting portion extending from the flange is integrated with a first substrate, for example, a printed circuit board (PCB), by forming a hole in the PCB, inserting the projecting portion of the stand-off through the hole, and attaching a second substrate to the first substrate with the flange therebetween. The flange can be at least partially received by a relief formed in one of the substrates or in an aperture in an adhesive layer between the two substrates. The stand-off can be further secured to the PCB using one or more of adhesives, interference fit techniques, snap-assembly features, and other applicable techniques. Alternatively, the stand-off can be attached to a substrate using a sliding snap feature or sliding interference fit. An attachable component can be attached to the projecting portion of the stand-off.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.