Method for manufacturing a miniature surface-mount electronic component
US7694407B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2008 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Jul 21, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4922
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A miniature surface-mount electronic component which can ensure sufficient impact resistance and vibration resistance especially in an application to a severe use environment such as a vehicle-mounted coil, by putting some contrivance into a method for fixing a coil in a molding process and a method for holding a core and terminals. A miniature surface-mount electronic component including a bar-shaped core 2 on which a winding wire 3 is wound, and metal plates 5, with an outer casing 7 made of an insulating resin molded, includes flanges 2b substantially quadrangular in section at both ends of the bar-shaped core 2, and vertical grooves a and b are provided on side surfaces of the flanges 2b of the bar-shaped core 2 as fixing portions for preventing positional displacement occurring when the outer casing 7 is molded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.