Heat sink with heat pipes
US7694718B2 · kind B2 · utility
6Cited by
5References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 2, 2006 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Jul 15, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink includes a first plate having a top portion and a bottom portion, a second plate projecting from the top portion of the first plate, and a plurality of fins thermally contacting the second plate. The second plate has a width larger than that of the first plate. The heat pipe includes a first portion embedded in the bottom portion of the first plate for directly contacting an electronic component to be cooled, and a second portion bent from one end of the first portion. The second portion is located at one side of the first plate, while the first portion of the heat pipe is located at a middle of the first plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.