Ball grid array (BGA) connection system and related method and ball socket
US7695287B2 · kind B2 · utility
10Cited by
23References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2006 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Dec 7, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.