Method of attaching a solder element to contact and the contact assembly formed thereby
US7695329B2 · kind B2 · utility
5Cited by
22References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2005 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Sep 15, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of attaching a solder element to a contact and the contact assembly formed thereby. The contact assembly is used in a connector. The solder element is either staked or stapled to the contact. The solder element can take a variety of shapes and disclosed herein is a tear-drop shape, a “wolf's head” shape and a circular shape. An over-stress feature is also provided for when the contact assembly is mounted to a printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.