Grinding wheel
US7695353B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 14, 2005 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Dec 24, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D5/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a grinding wheel in which abrasive tips for rough grinding and abrasive tips for finish grinding are alternately bonded to a periphery of a disk type base rotating about a rotation axis, each abrasive tip includes the abrasive layer formed by bonding abrasive grains and a lower layer overlaid and integrally for led with the abrasive layer. The abrasive tip is attached to the periphery of the base at the lower layer. A Young's modulus of the lower layer of the abrasive tip for finish grinding relative to a load acting on the grinding surface of the abrasive tip in an inward direction of the grinding wheel is less than that of the abrasive tip for rough grinding. Thereby, the surface of a workpiece can be both rough-ground and finish-ground with superhigh-precision surface roughness with using one grinding wheel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.