Versatile system for conditioning slurry in CMP process
US7695589B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2004 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Mar 22, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a system (100) for conditioning multi-component slurries utilized in chemical mechanical polishing (CMP) of semiconductor wafers (140). The system provides a first slurry component (108), and a second slurry component (120). A conditioning component (102) has first and second inlets, and an outlet operatively coupled to a dispensing system (138). First and second flow control components (116, 126) are operably intercoupled between the first and second inlets and the first and second slurry components, respectively. The system further provides a megasonic energy source (106), adapted to generate an energy field (118) across the conditioning component. A conveyance component (114) conducts the slurry components from the inlets through the energy field, and delivers a final mixture (136) of multi-component slurry to the outlet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.