Tin plating method
US7695605B2 · kind B2 · utility
3Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2004 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Mar 10, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0392
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.