Patent · US Expired

Fabricating surface mountable semiconductor components with leadframe strips

US7695990B2 · kind B2 · utility

8Cited by
16References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 23, 2005
Grant dateApr 13, 2010
Priority date
Expiry dateJan 11, 2026

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T436/188
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The invention relates to a method for producing an electrical leadframe (10), in particular for a light-emitting diode component, having at least one first electrical connection conductor (2) and at least one second electrical connection conductor (3).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.