Fabricating surface mountable semiconductor components with leadframe strips
US7695990B2 · kind B2 · utility
8Cited by
16References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2005 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Jan 11, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T436/188
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for producing an electrical leadframe (10), in particular for a light-emitting diode component, having at least one first electrical connection conductor (2) and at least one second electrical connection conductor (3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.