Connecting microsized devices using ablative films
US7696013B2 · kind B2 · utility
0Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2007 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Nov 26, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.