Conductive resin composition
US7696274B2 · kind B2 · utility
5Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2005 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Jun 4, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a conductive resin composition containing a polyamide, a polyphenylene ether, a polyester and a conductive carbon filler. The resin composition has attained excellent conductivity by being added with a small amount of the conductive carbon filler, while being excellent in fluidity and surface luster. Also disclosed is a molded body formed from such a resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.