Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator
US7696286B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2007 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Jul 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula (1) wherein Ar is a C6-C20 aryl group, R1 is a C1-C6 hydrocarbon group, R2 is a C1-C4 hydrocarbon group, W1 is oxygen or sulfur, RO is a C1-C6 hydrocarbon group, a=0-10, g=0-3, 0<m<1, 0<n<1, m+n=1 and m:n=1:10 to 1:1, and the resin composition has a moisture absorption rate of 0.22 weight % or less when the composition is humidified at 85° C. and 85% R.H. for 168 hours:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.