Conductive material compositions, apparatus, systems, and methods
US7696611B2 · kind B2 · utility
2Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2004 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Sep 7, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various apparatus and systems, as well as methods and articles, may include the use of several compositions, such as solder formulations, including about 78%-83% by weight of lead, about 9%-11% by weight of antimony, about 1%-3% by weight of silver, and a balance of tin. Some embodiments include a process of removing a previously-existing lead finish, and applying a new finish to the lead to improve solder operation compatibility, as well as solder joint reliability in high temperature environments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.