Apparatus and method for thermal stabilization of PCB-mounted electronic components within an enclosed housing
US7698023B2 · kind B2 · utility
4Cited by
19References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2009 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Aug 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.