Plasma processing apparatus
US7699957B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2007 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Aug 12, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/135
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a plasma processing apparatus, in which parasitic plasma is not generated in a transfer chamber. The plasma processing apparatus has a load lock chamber, a transfer chamber, a processing chamber, and gate valves installed between the chambers for transferring a substrate and opening and closing openings of the chambers. Each of the gate valves includes a valve housing provided between the chambers such that the valve housing contacts side surfaces of the chambers by interposing sealing members therebetween, and forming a designated closed space therein; a valve including a sealing plate contacting an inner surface of the valve housing on the side of the processing chamber, and a back plate contacting the inner surface of the valve housing on the side of the transfer chamber; a valve driving unit connected to the valve for moving the valve in the vertical direction; and a ground member formed on the surface of the valve for electrically connecting the valve and the valve housing when the valve contacts the inner surface of the valve housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.