Photosensitive resin composition, image forming material and image forming method using thereof
US7700264B2 · kind B2 · utility
0Cited by
4References
13Claims
0Family size
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Key dates
| Filing date | Oct 31, 2006 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Jun 2, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/145
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition containing an alkali soluble resin, an ethylenically unsaturated compound, a near infrared absorbing dye, a compound containing a halomethyl group and a compound containing an organoboron anion, wherein the alkali soluble resin is an acryl resin having one or more pendant groups in which both terminals of a diol compound have been blocked with isophorone diisocyanates and then (meth)acryloyl has been added. Also provided is an image forming material having a substrate, and a photosensitive layer formed by the photosensitive resin composition on the substrate, as well as an image forming method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.