Wafer/Ingot cleaning in wire saw cutting comprising an ethoxylated alcohol/polyalkylsiloxane mixture
US7700535B1 · kind B1 · utility
1Cited by
6References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 12, 2009 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Jan 12, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
There is provided a method and composition for rinsing sliced ingots into wafers from a wire saw cutting operation. The method uses an alkoxylated alcohol diluted in water alone or with a polyalkyl siloxane when the bath has a dynamic flow of water to prevent foaming.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.