Low-density molding compound
US7700670B2 · kind B2 · utility
Inventors
Key dates
| Filing date | May 15, 2006 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Oct 24, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2996
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A molding composition formulation includes a thermoset cross-linkable polymeric resin. Glass microspheroids are present such that upon cure of the resin the resulting article has a linear shrinkage of less than ±0.06% and a density of less than 1.65. An article formed from such a composition is further strengthened by the addition of a surface activating agent bonded to the surface of the glass microspheroids. Conventional particulate fillers when added to an inventive formulation provide enhanced performance when the filler particle has a size sufficiently small to insert within adjacent microspheroid interstitial voids. An unsaturated polyester resin so formed is particularly well suited for the formation of sheet molding compound formulations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.