Side-view optical diode package and fabricating process thereof
US7701050B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2007 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Jul 27, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3442
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.