Heat dissipation assembly
US7701708B2 · kind B2 · utility
3Cited by
36References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 26, 2007 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Mar 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation assembly for dissipating heat from a heat-generating component includes a first heat sink mounted on the heat-generating component for dissipating heat therefrom, and a second heat sink movably mounted to the first heat sink, to be adjustable relative to the first heat sink. The second heat sink can be moved to a desired position to fit a need of heat dissipation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.