Heat sink assembly
US7701718B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 23, 2008 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Oct 16, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly includes a base, a fin group located above a top of the base, a mounting bracket, and a fan mounted on a lateral side of the mounting bracket. The mounting bracket is integrally formed by a metal sheet. The mounting bracket includes a pedestal is located at a top of the base and connects with the base, and two sidewalls extending upwardly from opposite ends of the pedestal and sandwiching the fin group therebetween. The fan is mounted on a lateral side of the sidewalls of the mounting bracket. The pedestal integrally forms four mounting arms. Four fasteners extend through the mounting arms for securing the heat sink assembly to a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.