Electronic component module and radio comunications equipment
US7701728B2 · kind B2 · utility
23Cited by
23References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 28, 2005 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Oct 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An IC element 2 having an oscillation circuit and an amplification circuit is mounted on a wiring board 1, the IC element 2 is covered with a sealing resin layer 4 having a window 4a on an upper surface of the IC element 2, and a shielding layer 5 is made to adhere to the sealing resin layer 4 and the window 4a from above. In a simple configuration, the entrance of electromagnetic waves into the IC element 2 is reduced, which allows a transmission signal from the IC element 2 to be stabilized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.