Wafer carrier positioning structure
US7703609B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 20, 2007 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Nov 23, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer carrier positioning structure including a carrier body having a bottom face and a frame body provided in a peripheral part of the bottom face to project downwardly, for housing a wafer therein so that the wafer is parallel to the bottom face. Further, the wafer positioning structure includes a guide member detachably attached to the bottom face of the carrier body, a guide groove provided in the guide member, for engaging with a positioning pin projecting from a mounting face upon mounting the carrier body to the mounting face, so as to guide the carrier body to a regular mounting position, and a locking portion provided in the guide member, locking to an inside face of the frame body while elastically having contact with the inside face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.