Semiconductor substrate cleaning method and semiconductor substrate cleaning machine
US7704329B2 · kind B2 · utility
1Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2007 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Dec 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02074
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A semiconductor substrate cleaning method includes a first cleaning step of cleaning the surface of a semiconductor substrate with the use of a first brush and a second cleaning step of cleaning the surface of the semiconductor substrate with the use of a second brush after the first cleaning step. The second cleaning step is performed under a condition that suppresses recontamination of the surface of the semiconductor substrate in comparison with the first cleaning step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.