Apparatus and method for fabricating bonded substrate
US7704348B2 · kind B2 · utility
1Cited by
26References
1Claims
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Key dates
| Filing date | Oct 21, 2005 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Mar 10, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.