Resin-molded component for signal reader and method for molding thereof
US7704408B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 22, 2005 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Dec 16, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G9/113
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a resin-molded component for signal reader, which is light in weight and is able to improve the vibration damping property and to increase the resonance frequency, and which is excellent in heat dissipation. Specifically, it provides a resin-molded component for signal reader structured by 55 to 75% by weight of liquid crystalline polymer (A) composed of structural units expressed by general formulae (I) through (IV):—O—Ar1—CO— (I)—CO—Ar2—CO— (II)—O—Ar3—O— (III)—O—Ar4—CO— (IV)(where, Ar1 is 2,6-naphthalene group, Ar2 is selected from 1,2-phenylene group, 1,3-phenylene group, and, 1,4-phenylene group, Ar3 is selected from 1,3-phenylene group, 1,4-phenylene group, and p,p′-polyphenylene group, and Ar4 is 1,4-phenylene group); 20 to 10% by weight of inorganic hollow sphere (B1); and 25 to 15% by weight of fibrous inorganic filler (B2), and has 1.4 or smaller specific gravity d, 0.5 W/m·K or larger thermal conductivity λ, and 10 GPa or larger flexural modulus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.