Pattern replication with intermediate stamp
US7704425B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2005 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Sep 20, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2059/023
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a two-step process for transferring a pattern from a template (1) to a target surface of a substrate, by creating an intermediate flexible polymer stamp (5) from the template in a primary step, and then using the polymer stamp to make an imprint in a radiation-sensitive moldable layer on the target surface in a secondary step. In the secondary step, the process steps of pressing the polymer stamp and the substrate against each other, UV exposure of the moldable layer through the polymer stamp, and postbaking of the radiated moldable layer, are all performed at a control constant temperature, in order to eliminate damages to the pattern created in the moldable layer caused by thermal expansion effects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.