Substrate embedded with passive device
US7704846B2 · kind B2 · utility
1Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2006 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | May 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a substrate embedded with a passive device, comprising the steps of (a) molding the passive device and (b) mounting the molded passive device in a cavity formed on the substrate, is disclosed. The substrate embedded with a passive device and the manufacturing method thereof in accordance with the present invention can prevent warpage of the substrate caused by disproportioned properties of materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.