Lead frame structure of light emitting diode
US7705435B2 · kind B2 · utility
1Cited by
3References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 4, 2007 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Apr 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
Abstract
A lead frame structure of a light emitting diode is disclosed. The lead frame structure comprises a bonding zone, two wing-shaped reflective surfaces, a first electrode lead, and a second electrode lead. The first electrode lead and the second electrode lead are respectively connected to the bonding zone. The bonding zone bonds the light emitting diode. The reflective surfaces are formed on both sides of the bonding zone. A predetermined angle is formed between the bonding zone and the wing-shaped reflective surfaces for reflecting the side light emitted from the light emitting diode towards a predetermined direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.