Broadband micro-machined thermal power sensor
US7705582B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 16, 2007 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Feb 12, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A power sensor includes a substrate, an aperture within the substrate, a membrane formed over at least a portion of the substrate and extending over the aperture, and an electro-thermal transducer partially supported by the insulating membrane. The electro-thermal transducer includes an impedance matched, bifurcated load supported over the aperture by the insulating membrane, and a thermopile extending over the aperture and supported by the insulating membrane, the thermopile being adapted to generate a voltage in response to heat generated in the impedance matched, bifurcated load. A signal conductor is electrically connected with one end of the impedance matched, bifurcated load to guide electromagnetic signals to the load, and a conductive under-layer stratified from the signal conductor by an intermediary dielectric is connected with an opposite end of the impedance matched, bifurcated load to act as a ground plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.