Capacitor interconnection
US7705691B2 · kind B2 · utility
25Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2005 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Oct 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate for power decoupling and a method of forming a substrate for power decoupling. The substrate comprises one or more decoupling capacitors; and one or more interconnections to the decoupling capacitors. At least one of the interconnections comprises a lossy material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.