Fill level sensor or pressure sensor with an anti-adhesive coating
US7707881B2 · kind B2 · utility
1Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2006 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Jan 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q19/08
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described is a component for a fill level measuring device or for a pressure measuring device. The component may include a coating with a microsmooth surface so that the microsmooth surface remains essentially free of any deposits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.