Die attach area cut-on-fly method and apparatus
US7709294B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2005 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Oct 22, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.