Microelectronic devices having an EMI shield and associated systems and methods
US7709915B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 7, 2008 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | May 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
Abstract
Microelectronic devices having an EMI shield, systems including such microelectronic devices, and methods for manufacturing such microelectronic devices. One embodiment of a microelectronic device comprises an imaging system comprising a microelectronic die, an optics assembly, and an electromagnetic interference (EMI) shield. The microelectronic die includes an image sensor, processing components electrically coupled to the image sensor, a first interconnect electrically isolated from the processing components, and a second interconnect electrically coupled to the processing components. The optics assembly is aligned with the image sensor, and the electromagnetic interference (EMI) shield is between the optics assembly and the processing components. The EMI shield is electrically coupled to the first interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.