Metal-base circuit board and its manufacturing method
US7709939B2 · kind B2 · utility
3Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2004 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Mar 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metal base circuit board to be used for a hybrid integrated circuit, including circuits provided on a metal plate via an insulating layer, a power semiconductor mounted on the circuit, and a control semiconductor to control the power semiconductor, provided on the circuit. A low capacitance portion is embedded under a circuit portion on which the control semiconductor is mounted, preferably. The low capacitance portion is made of a resin containing an inorganic filler and has a dielectric constant of from 2 to 9.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.