Micro device encapsulation
US7709940B2 · kind B2 · utility
3Cited by
5References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2006 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Apr 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged die includes a substrate having an upper surface and a micro device on the upper surface and an encapsulation cover comprising one or more grooves on its lower surface. The lower surface of the encapsulation cover and the upper surface of the substrate are bonded together to form a plurality of air-tight closed-loop interfaces and encapsulate the micro device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.