Resin-sealed semiconductor device and method of manufacturing the same
US7709941B2 · kind B2 · utility
1Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2005 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Feb 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor pellet and chip components are provided on an insulating substrate, and are sealed with a molding resin that is molded by transfer molding. The chip components are positioned so as to surround the semiconductor pellet on all four sides. The lengthwise directions of the chip components surrounding the semiconductor pellet are aligned in a uniform direction. The insulating substrate is set within a die molding apparatus so that during resin injection, the lengthwise directions of the chip components are aligned substantially perpendicularly to the direction of flow of the injected resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.