Semiconductor device
US7709953B2 · kind B2 · utility
0Cited by
2References
5Claims
0Family size
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Key dates
| Filing date | Dec 22, 2008 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Dec 22, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a multi-chip package semiconductor device, a drive chip having an analog circuit and a logic chip having a digital circuit are mounted within the same package. The driver chip includes a logic-chip power-supply circuit that makes up a logic-chip power supply for the logic chip and a group of operational amplifiers that amplify detection signals from a plurality of sensors. The driver chip has the shape of a square as a whole, and the plurality of operational amplifiers and the logic-chip power-supply circuit are disposed in diagonally opposed positions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.