Illumination assembly with enhanced thermal conductivity
US7710045B2 · kind B2 · utility
28Cited by
18References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2006 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Dec 27, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Illumination assemblies include a substrate having a first and second electrically conductive layer separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with thermally conductive particles. At least a portion of the thermally conductive particles simultaneously contact both the first and second electrically conductive layers. A plurality of light sources such as LEDs or other miniature light sources are preferably disposed on the first conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.