Testing method for semiconductor device having ball-shaped external electrode
US7710133B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 21, 2008 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | May 21, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is a method of testing electrical characteristics of a semiconductor device having a ball-shaped external electrode. The method comprises preparing a plurality of cantilever-type contactors each supported by a support plate at a given position, and formed in such a manner that a tip thereof has a flat surface with an arc-shaped edge in an outer peripheral region thereof, and a cross-sectional diameter in a vicinity of the tip is greater than a radius of the ball-shaped external electrode, and pairing the cantilever-type contactors to provide paired two contactors. The method includes the steps of: pressing either one of the support plate and the semiconductor device toward the other in such a manner that the arc-shaped edges of the paired two contactors are brought into contact with respective ones of two surface regions of the ball-shaped external electrode divided by an axis of the ball-shaped external electrode passing through a middle point between the two positions where the paired two contactors are supported, so as to form Kelvin contacts; and further overly driving either one of the support plate and the semiconductor device relative to the other in such a manner …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.