High conductivity ground planes for integrated lead suspensions
US7710687B1 · kind B1 · utility
34Cited by
23References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2006 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Dec 14, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/484
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated lead flexure or suspension including an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The traces are free of a conductive shield layer on the side opposite the insulating layer. One or more voids extend through the stainless steel layer below the traces. The voids are filled with a high conductivity metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.