Method and device for exposing electronic components
US7713376B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2004 |
| Grant date | May 11, 2010 |
| Priority date | — |
| Expiry date | Dec 14, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1978
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of exposing components, which are carried by a carrier tape (2), arranged in sequence along the carrier tape (2) and covered by a cover (3). The cover is attached to the carrier tape having a lower surface facing the sequence of components. The method is performed by, while feeding the carrier tape towards the picking position, separating a first portion of the cover from a first portion (31) of the carrier tape. Thereafter, guiding a thus loosened portion of the cover towards the second side of the carrier tape. Performing said guiding such that before reaching the picking position, while being raised to an upright position, the cover is automatically gathered by being folded, so that at least two portions of the lower surface of the cover face each other, thereby reducing the height of the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.