Patent · US Active

Method and system of tape automated bonding

US7713790B2 · kind B2 · utility

1Cited by
19References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 28, 2008
Grant dateMay 11, 2010
Priority date
Expiry dateJul 28, 2028

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/10681
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.