Patent · US Active

Resin composition, cured product and optical parts

US7714096B2 · kind B2 · utility

0Cited by

12References

18Claims

0Family size

Assignees

Tokyo Institute of Technology · JP
JSR CORPORATION · JP

Inventors

Mitsuru Ueda · Tokyo, JP
Shinji Ando · Tokyo, JP
Jin-gang Liu · Tokyo, JP
Yuzi Shibasaki · Tokyo, JP
Yasuhiro Nakamura · Tokyo, JP
Shuichi Sugawara · Kasai, JP
Miwa Ariyuki · Tokyo, JP
Yuichi Eriyama · Kuwana, JP
Keisuke Kuriyama · Tokyo, JP
Hideaki Takase · Tokyo, JP

Key dates

Filing date	Mar 28, 2008
Grant date	May 11, 2010
Priority date	—
Expiry date	May 8, 2028

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09K2323/027
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

It is provided for a resin composition including (A) at least one polyamic acid having the structure represented by the following formula (1):wherein R1 is independently an alkyl group having 1 to 3 carbon atoms or a cyano group; a is independently an integer of 0 to 4; R is a tetravalent organic group; n is an integer of 1 to 4; and m is an integer of 1 to 100,000, and (E) an organic solvent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.