Laminated bus bars and methods of manufacture thereof
US7714230B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 14, 2008 |
| Grant date | May 11, 2010 |
| Priority date | — |
| Expiry date | Feb 14, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49194
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of assembling a multilayer bus bar assembly includes coating a dielectric layer with a molten reactive hot-melt adhesive, placing the dielectric layer between first and second subassemblies, wherein the first and second subassemblies comprise a conductive element, adhering the molten reactive hot-melt adhesive to the subassemblies by applying a pressure of at least about one bar to the multilayer bus bar assembly for at least about one minute prior to the adhesive cooling to room temperature to provide a bonding strength between the dielectric material and a selected one of the first and second subassemblies of at least 1500 Newtons on a 25 millimeter by 25 millimeter sample when tested in accordance with ASTM D-1062.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.