Light emitting device and method of manufacturing the same
US7714337B2 · kind B2 · utility
16Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2007 |
| Grant date | May 11, 2010 |
| Priority date | — |
| Expiry date | Jul 9, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0262
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device and a method of manufacturing the same are disclosed. The light emitting device includes a buffer layer formed on a substrate, a nitride semiconductor layer including a first semiconductor layer, an active layer, and a second semiconductor layer, which are sequentially stacked on the buffer layer, a portion of the first semiconductor layer being exposed to the outside by performing mesa etching from the second semiconductor layer to the portion of the first semiconductor layer, and at least one nanocone formed on the second semiconductor layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.